Cardlam 220

Cardlam™ C220 lamination pads offer increased productivity and quality and are ideally suited to high volume modern Twin stack lamination systems.

High Speed

High heat transfer speed through the stack to reduce lamination cycle time.

Durable

Materials used in Pad manufacturing significantly increase product lifetime compared to Aramid felt construction pads

Flexible Options

Available in standard thickness of 2.0mm or as Cardlam C220+ in 3.4mm thickness to improve compensation properties with minimal heat transfer speed reduction.

Cardlam C220 lamination pads have been developed for specific use in high performance lamination of Credit and Smart cards achieving:

  • Increased lamination output volume versus other pad types via reduced cycle time
  • Rapid heat transfer to achieve core to core bond in the centre of the stack.
  • Excellent compression recovery qualities.
  • High durability – typically 4000–6000 operations.
  • Compatible with all types of Single and Twin Stack lamination machines.
  • Easy handling – suitable for tilt table systems.

10% to 15% increase in lamination output is achievable with Cardlam 220 pads due to the rapid and even heat distribution.

The pads are also easy to handle, do not stick to the lamination platens and are suitable for tilt table systems.

The C220 pad can also be supplied as C220+ which is 50% thicker due to increased layer of Silicone in the centre of the Pad. The additional thickness increases the compensation properties of the pad with minimal effect on the Heat transfer speed.

Material Construction:

  • Cardlam 220 pads are manufactured with a silicone centre layer protected
    with low profile heat conductive polymer silicone embedded reinforcement layers to the exterior surfaces.

Typical Applications:

  • Single stack lamination systems and high volume Twin Stack Laminators

Average Lifecycle:

  • 4000-6000 lamination cycles (subject to usage environment)

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