Cardlam 230

The Cardlam C230 range provides a solution for high temperature lamination. With rapid heat transfer they are recommended for single stack laminators. The pads are used across the world in polycarbonate manufacturing processes and in large format platen lamination of all kinds.

High Temperature

Cardlam C230 pads support lamination temperatures of up to 230 degrees Celsius and are ideally suited for the lamination of Polycarbonate and other high melt point materials

Durability

Cardlam Copsil is our most durable product. They enable our customers to achieve product cycle lifetimes of up to 10,000 cycles (subject to operating environment)

Heat Transference

C230 pads are our fastest heat transfer speed pads which allows card and RFID inlay manufacturers to increase throughput without compromising product quality.

It is possible for manufacturers to achieve a throughput increase of up to 30% in lamination output using Cardlam C230 pads.

Rapid and even heat distribution is also heightened within the quality of the pads, and its construct will assist in the elimination of laking and frosting. Applications for the pads include the following: Identity cards, banking cards, large format platen lamination of all kinds and RFID pre-lams.

As a highly durable pad our customers can expect to achieve around 8000-10,000 operations.

The silicone embedded into the metal construction of the pad ensures a high level of pressure compensation and compression recovery.

Copsil pads are available in the C230 product family group and bespoke weave patterns for the mesh can be provided on request.

Material Construction:

  • Copper or Brass wire mesh with silicone woven inside.

Average cycles:

  • 8000-10,000

Applications:

  • Polycarbonate cards, banking, Large format lamination, RFID pre-lams

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